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For example, a chip designed to run in a digital voice recorder or a high-efficiency video codec e. Application-specific standard product ASSP chips are intermediate between ASICs and industry standard integrated circuits like the series or the series.

As feature sizes have shrunk and design tools improved over the years, the maximum complexity and hence functionality possible in an ASIC has grown from 5, logic gates to over million. Field-programmable gate arrays FPGA are the modern-day technology for building a breadboard or prototype from standard parts [ vague ] ; programmable logic blocks and programmable interconnects allow the same FPGA to be used in many different applications.

Therefore, device manufacturers typically prefer FPGAs for prototyping and devices with low production volume and ASICs for very large production volumes where NRE costs can be amortized across many devices. Early ASICs used gate array technology. By , Ferranti and Interdesign were manufacturing early bipolar gate arrays. Complementary metal-oxide-semiconductor CMOS technology opened the door to the broad commercialization of gate arrays.

Metal-oxide-semiconductor MOS standard cell technology was introduced by Fairchild and Motorola , under the trade names Micromosaic and Polycell, in the s. A successful commercial application of gate array circuitry was found in the low-end 8-bit ZX81 and ZX Spectrum personal computers , introduced in and Customization occurred by varying a metal interconnect mask.

Gate arrays had complexities of up to a few thousand gates; this is now called mid-scale integration. Later versions became more generalized, with different base dies customized by both metal and polysilicon layers. Some base dies also include random-access memory RAM elements.

In the mids, a designer would choose an ASIC manufacturer and implement their design using the design tools available from the manufacturer. While third-party design tools were available, there was not an effective link from the third-party design tools to the layout and actual semiconductor process performance characteristics of the various ASIC manufacturers.

Most designers used factory-specific tools to complete the implementation of their designs. A solution to this problem, which also yielded a much higher density device, was the implementation of standard cells. Standard-cell design is the utilization of these functional blocks to achieve very high gate density and good electrical performance.

By the late s, logic synthesis tools became available. Such tools could compile HDL descriptions into a gate-level netlist. Standard-cell integrated circuits ICs are designed in the following conceptual stages referred to as electronics design flow , although these stages overlap significantly in practice:. These steps, implemented with a level of skill common in the industry, almost always produce a final device that correctly implements the original design, unless flaws are later introduced by the physical fabrication process.

The design steps also called design flow , are also common to standard product design. The significant difference is that standard-cell design uses the manufacturer's cell libraries that have been used in potentially hundreds of other design implementations and therefore are of much lower risk than a full custom design.

Standard cells produce a design density that is cost-effective, and they can also integrate IP cores and static random-access memory SRAM effectively, unlike gate arrays. Gate array design is a manufacturing method in which diffused layers, each consisting of transistors and other active devices , are predefined and electronics wafers containing such devices are "held in stock" or unconnected prior to the metallization stage of the fabrication process.

The physical design process defines the interconnections of these layers for the final device. For most ASIC manufacturers, this consists of between two and nine metal layers with each layer running perpendicular to the one below it. Non-recurring engineering costs are much lower than full custom designs, as photolithographic masks are required only for the metal layers.

Production cycles are much shorter, as metallization is a comparatively quick process; thereby accelerating time to market. Often difficulties in routing the interconnect require migration onto a larger array device with a consequent increase in the piece part price. These difficulties are often a result of the layout EDA software used to develop the interconnect. Pure, logic-only gate-array design is rarely implemented by circuit designers today, having been almost entirely replaced by field-programmable devices.

The most prominent of such devices are field-programmable gate arrays FPGAs which can be programmed by the user and thus offer minimal tooling charges, non-recurring engineering, only marginally increased piece part cost, and comparable performance.

Today, gate arrays are evolving into structured ASICs that consist of a large IP core like a CPU , digital signal processor units, peripherals , standard interfaces , integrated memories , SRAM , and a block of reconfigurable , uncommitted logic. This shift is largely because ASIC devices are capable of integrating large blocks of system functionality, and systems on a chip SoCs require glue logic , communications subsystems such as networks on chip , peripherals , and other components rather than only functional units and basic interconnection.

In their frequent usages in the field, the terms "gate array" and "semi-custom" are synonymous when referring to ASICs. Process engineers more commonly use the term "semi-custom", while "gate-array" is more commonly used by logic or gate-level designers.

By contrast, full-custom ASIC design defines all the photolithographic layers of the device. The benefits of full-custom design include reduced area and therefore recurring component cost , performance improvements, and also the ability to integrate analog components and other pre-designed —and thus fully verified—components, such as microprocessor cores, that form a system on a chip.

The disadvantages of full-custom design can include increased manufacturing and design time, increased non-recurring engineering costs, more complexity in the computer-aided design CAD and electronic design automation systems, and a much higher skill requirement on the part of the design team.

Automated layout tools are quick and easy to use and also offer the possibility to "hand-tweak" or manually optimize any performance-limiting aspect of the design. Structured ASIC design also referred to as " platform ASIC design " is a relatively new trend in the semiconductor industry, resulting in some variation in its definition.

However, the basic premise of a structured ASIC is that both manufacturing cycle time and design cycle time are reduced compared to cell-based ASIC, by virtue of there being pre-defined metal layers thus reducing manufacturing time and pre-characterization of what is on the silicon thus reducing design cycle time. Definition from Foundations of Embedded Systems states that: [7]. Design differentiation and customization is achieved by creating custom metal layers that create custom connections between predefined lower-layer logic elements.

Because only a small number of chip layers must be custom-produced, "structured ASIC" designs have much smaller non-recurring expenditures NRE than "standard-cell" or "full-custom" chips, which require that a full mask set be produced for every design.

This is effectively the same definition as a gate array. What distinguishes a structured ASIC from a gate array is that in a gate array, the predefined metal layers serve to make manufacturing turnaround faster. In a structured ASIC, the use of predefined metallization is primarily to reduce cost of the mask sets as well as making the design cycle time significantly shorter. For example, in a cell-based or gate-array design the user must often design power, clock, and test structures themselves.

By contrast, these are predefined in most structured ASICs and therefore can save time and expense for the designer compared to gate-array based designs. Likewise, the design tools used for structured ASIC can be substantially lower cost and easier faster to use than cell-based tools, because they do not have to perform all the functions that cell-based tools do.

In some cases, the structured ASIC vendor requires customized tools for their device e. Cell libraries of logical primitives are usually provided by the device manufacturer as part of the service. Although they will incur no additional cost, their release will be covered by the terms of a non-disclosure agreement NDA and they will be regarded as intellectual property by the manufacturer. Usually, their physical design will be pre-defined so they could be termed "hard macros".

What most engineers understand as " intellectual property " are IP cores , designs purchased from a third-party as sub-components of a larger ASIC. They may be provided in the form of a hardware description language often termed a "soft macro" , or as a fully routed design that could be printed directly onto an ASIC's mask often termed a "hard macro". Many organizations now sell such pre-designed cores — CPUs, Ethernet, USB or telephone interfaces — and larger organizations may have an entire department or division to produce cores for the rest of the organization.

Indeed, the wide range of functions now available in structured ASIC design is a result of the phenomenal improvement in electronics in the late s and early s; as a core takes a lot of time and investment to create, its re-use and further development cuts product cycle times dramatically and creates better products.

Additionally, open-source hardware organizations such as OpenCores are collecting free IP cores, paralleling the open-source software movement in hardware design. Soft macros are often process-independent i. Hard macros are process-limited and usually further design effort must be invested to migrate port to a different process or manufacturer.

Some manufacturers and IC design houses offer multi-project wafer service MPW as a method of obtaining low cost prototypes.

Often called shuttles, these MPWs, containing several designs, run at regular, scheduled intervals on a "cut and go" basis, usually with limited liability on the part of the manufacturer. The contract involves delivery of bare dies or the assembly and packaging of a handful of devices. The service usually involves the supply of a physical design database i. The manufacturer is often referred to as a "silicon foundry" due to the low involvement it has in the process. An application-specific standard product or ASSP is an integrated circuit that implements a specific function that appeals to a wide market.

ASSPs are used in all industries, from automotive to communications. Both of these examples are specific to an application which is typical of an ASIC but are sold to many different system vendors which is typical of standard parts. From Wikipedia, the free encyclopedia. For other uses, see ASIC disambiguation. Integrated circuit customized typically optimized for a specific task. This article includes a list of general references , but it remains largely unverified because it lacks sufficient corresponding inline citations.

Please help to improve this article by introducing more precise citations. October Learn how and when to remove this template message. Main article: Standard cell. Main article: Full custom. New York: McGraw-Hill. ISBN OCLC The Silicon Engine. Computer History Museum. Retrieved 9 November Retrieved 28 January Application-Specific Integrated Circuits. Addison-Wesley Professional. Logic Design. Foundations of Embedded Systems. Studies in Systems, Decision and Control. Cham: Springer International Publishing.

S2CID Processor technologies. Data dependency Structural Control False sharing. Branch prediction Memory dependence prediction. Single-core Multi-core Manycore Heterogeneous architecture.



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Launched towards the end of , Zcash ZEC is a popular privacy-focused digital currency. However, unlike bitcoin, which utilizes the Sha algorithm, it employs the Equihash algorithm within its consensus mechanism. ASICs application-specific integrated circuit are special machines intended to confer their holder with an upper hand in mining cryptocurrencies. These machines are generally designed to work best with a specific algorithm and are especially common for the Bitcoin algorithm, Sha To begin mining the digital currency, requires a computer, an internet connection, and access to electricity or another source of affordable energy. To get started, download the Zcash mining software from the website and wait for the blockchain to sync, after which you are free to begin mining. To increase your hashrate you can benefit from employing graphics cards.

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The primary goal of the project is to develop Bitcoin mining tools and techniques which will significantly outperform existing mining equipment, both in speed and energy consumption. While it is understood that this is extremely ambitious, the radically advanced technologies being utilised; quantum computing, Artifical Intelligence and Deep Learning, amongst others, renders the goal achievable. For this purpose, QBT has assembled a team of 13 sector experts, which is now fully operational. The members of the team have been selected from across the UK and Italy , and includes highly skilled professionals, Ph. QBT has entered into formal agreements with various university departments to retain the services of the new team.


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For example, a chip designed to run in a digital voice recorder or a high-efficiency video codec e. Application-specific standard product ASSP chips are intermediate between ASICs and industry standard integrated circuits like the series or the series. As feature sizes have shrunk and design tools improved over the years, the maximum complexity and hence functionality possible in an ASIC has grown from 5, logic gates to over million. Field-programmable gate arrays FPGA are the modern-day technology for building a breadboard or prototype from standard parts [ vague ] ; programmable logic blocks and programmable interconnects allow the same FPGA to be used in many different applications. Therefore, device manufacturers typically prefer FPGAs for prototyping and devices with low production volume and ASICs for very large production volumes where NRE costs can be amortized across many devices. Early ASICs used gate array technology.

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